Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12008302 | Integrated circuit with thicker metal lines on lower metallization layer | Yuan-Te Hou, Chung-Hsing Wang, Yung-Chin Hou | 2024-06-11 |
KC
Kuang-Hung Chang
Overall (2024): #378,907 of 561,600Top 70%
1
Patents 2024