Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154851 | Method of forming a semiconductor device with inter-layer vias | Yi-Lin Chuang, Jia-Jye Shen | 2024-11-26 |
CC
Ching-Fang Chen
Overall (2024): #515,277 of 561,600Top 95%
1
Patents 2024