DP

DongSam Park

SC Stats Chippac: 1 patents #24 of 65Top 40%
Overall (2024): #481,814 of 561,600Top 90%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12107028 Thermally enhanced FCBGA package KyungOe Kim, Wagno Alves Braganca, JR. 2024-10-01