Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107028 | Thermally enhanced FCBGA package | KyungOe Kim, DongSam Park | 2024-10-01 |
| 12074135 | Semiconductor device and method of controlling warpage during LAB | KyungOe Kim | 2024-08-27 |
| 11929334 | Die-beam alignment for laser-assisted bonding | KyungOe Kim, TaeKeun Lee | 2024-03-12 |