Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12181796 | Wiring formation method and transfer mold manufacturing method | Hiroshi Komatsu | 2024-12-31 |
| 12031649 | Disengagement prevention structure for pipe connecting portion | Mitsuhiro Mori, Yoshihiro Kumaki, Masanori Iga | 2024-07-09 |
| 12027721 | Electronic device | Nobuyuki TENNO, Yasushi Oyama, Byung No Bae | 2024-07-02 |