Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12181796 | Wiring formation method and transfer mold manufacturing method | Daisuke Sakai | 2024-12-31 |
| 12172440 | Liquid jetting structure, liquid jetting head, and liquid jetting device | Tsutomu Yokouchi | 2024-12-24 |