Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165900 | Method of mechanical separation for a double layer transfer | Marcel Broekaart, Ionut Radu | 2024-12-10 |
| 12142517 | Method for transferring a useful layer from a donor substrate onto a support substrate by applying a predetermined stress | Oleg Kononchuk, Nadia Ben Mohamed | 2024-11-12 |
| 12094759 | Method for transferring blocks from a donor substrate onto a receiver substrate by implanting ions in the donor substrate through a mask, bonding the donor substrate to the receiver substrate, and detaching the donor substrate along an embrittlement plane | Bruno Ghyselen | 2024-09-17 |
| 12002697 | Method for detecting the splitting of a substrate weakened by implanting atomic species | Francois Rieutord, Frédéric Mazen, Oleg Kononchuk, Nadia Ben Mohamed | 2024-06-04 |
| 12002690 | System for fracturing a plurality of wafer assemblies | Oleg Kononchuk, Nadia Ben Mohamed | 2024-06-04 |
| 11930710 | Hybrid structure and a method for manufacturing the same | — | 2024-03-12 |
| 11881429 | Method for transferring a useful layer onto a support substrate | Oleg Kononchuk, Nadia Ben Mohamed | 2024-01-23 |
| 11876015 | Method for transferring a useful layer to a carrier substrate | Oleg Kononchuk, Nadia Ben Mohamed, Franck Colas | 2024-01-16 |