Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142517 | Method for transferring a useful layer from a donor substrate onto a support substrate by applying a predetermined stress | Didier Landru, Oleg Kononchuk | 2024-11-12 |
| 12100727 | Method for manufacturing a substrate for a front-facing image sensor | Walter Schwarzenbach, Ludovic Ecarnot, Damien Massy, Nicolas Daval, Christophe Girard +1 more | 2024-09-24 |
| 12002690 | System for fracturing a plurality of wafer assemblies | Didier Landru, Oleg Kononchuk | 2024-06-04 |
| 12002697 | Method for detecting the splitting of a substrate weakened by implanting atomic species | Francois Rieutord, Frédéric Mazen, Didier Landru, Oleg Kononchuk | 2024-06-04 |
| 11881429 | Method for transferring a useful layer onto a support substrate | Didier Landru, Oleg Kononchuk | 2024-01-23 |
| 11876015 | Method for transferring a useful layer to a carrier substrate | Didier Landru, Oleg Kononchuk, Franck Colas | 2024-01-16 |