Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185055 | Multi-cavity packaging for microelectromechanical system microphones | Guofeng Chen, Rakesh Kumar, You Qian, Michael Jon Wurtz | 2024-12-31 |
| 12101601 | Piezoelectric microelectromechanical system microphone with optimized output capacitance | Guofeng Chen, You Qian, Rakesh Kumar, Michael Jon Wurtz | 2024-09-24 |
| 12037239 | Method for producing monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS | You Qian, Rakesh Kumar | 2024-07-16 |