Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021515 | Semiconductor chip including chip pads of different surface areas, and semiconductor package including the semiconductor chip | Ju-il Eom, Woo Jin Lee | 2024-06-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021515 | Semiconductor chip including chip pads of different surface areas, and semiconductor package including the semiconductor chip | Ju-il Eom, Woo Jin Lee | 2024-06-25 |