Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021515 | Semiconductor chip including chip pads of different surface areas, and semiconductor package including the semiconductor chip | Woo Jin Lee, Hyung Ho Cho | 2024-06-25 |
| 12015015 | Semiconductor package and semiconductor module including the same | Byung Jun Bang | 2024-06-18 |