Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176291 | Electronic package and manufacturing method thereof | Chao Pu, Chi-Ching Ho, Yi-Min Fu, Shuai Liu | 2024-12-24 |
| 12051641 | Electronic package and manufacturing method thereof | Yi-Min Fu, Chi-Ching Ho, Cheng-Yu Kang | 2024-07-30 |