Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176291 | Electronic package and manufacturing method thereof | Chao Pu, Yi-Min Fu, Yu-Po Wang, Shuai Liu | 2024-12-24 |
| 12125828 | Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same | Bo MA, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang | 2024-10-22 |
| 12051641 | Electronic package and manufacturing method thereof | Yi-Min Fu, Cheng-Yu Kang, Yu-Po Wang | 2024-07-30 |
| 11923337 | Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same | Bo MA, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang | 2024-03-05 |