Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131946 | Method to form contacts with multiple depth by enhanced CESL | Min-hwa Chi, Xian Zhang | 2024-10-29 |
| 11978702 | Simultaneous self-forming hea barrier and Cu seeding layers for Cu interconnect | Yong Zhao, Min-hwa Chi | 2024-05-07 |
| 11860650 | Method for monitoring and controlling supporting posture of supporting-type hydraulic support | Yunyue Xie, Shaoqi Zhang, Weikang Song, Maolin TIAN, Hongtian Xiao | 2024-01-02 |