Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12146057 | Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board | Hiroyuki IGUCHI, Masayuki Iwasaki | 2024-11-19 |
| 12110356 | Heat-curable resin composition | Rina SASAHARA | 2024-10-08 |
| 12012485 | Heat-curable citraconimide resin composition | Yoshihiro TSUTSUMI, Rina SASAHARA | 2024-06-18 |
| 11984327 | Method for producing power module, and power module | Kazuaki Sumita, Masahiro KANETA | 2024-05-14 |