Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12146057 | Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board | Hiroyuki IGUCHI, Naoyuki KUSHIHARA | 2024-11-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12146057 | Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board | Hiroyuki IGUCHI, Naoyuki KUSHIHARA | 2024-11-19 |