Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122904 | Thermosetting resin composition and prepreg, laminate and printed circuit board using same | Huayong FAN, Zengbiao Huang | 2024-10-22 |
| 11930595 | Circuit material and circuit board containing the same | Weifeng YIN, Cui HUO, RUI-WU LIU, Shanyin YAN | 2024-03-12 |