Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122904 | Thermosetting resin composition and prepreg, laminate and printed circuit board using same | Zengbiao Huang, Yongjing XU | 2024-10-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122904 | Thermosetting resin composition and prepreg, laminate and printed circuit board using same | Zengbiao Huang, Yongjing XU | 2024-10-22 |