Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107101 | Package structure, packaging method, camera module, and electronic equipment | Kerui Xi, Xuhui Peng, Feng Qin, Zhenyu JIA | 2024-10-01 |
| 12057324 | Semiconductor package having a semiconductor element and a wiring structure | Xuhui Peng, Kerui Xi, Feng Qin, Jie Zhang | 2024-08-06 |
| 11901324 | Chip package method and chip package structure | Kerui Xi, Feng Qin, Jine Liu, Xiaohe Li | 2024-02-13 |