Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062649 | Light-emitting module comprising plurality of light emitting diodes and epitaxial region and manufacturing method thereof and display device | Lu Yao, Wanchun Du, Xupeng Wang, Feng Qin | 2024-08-13 |
| 11901324 | Chip package method and chip package structure | Kerui Xi, Feng Qin, Xiaohe Li, Tingting Cui | 2024-02-13 |