YH

Yasutoshi Hideshima

SE Seiko Epson: 3 patents #138 of 1,165Top 15%
Overall (2024): #60,359 of 561,600Top 15%
3
Patents 2024

Issued Patents 2024

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11878345 Thixomolding material Shunsuke UCHIZONO, Setsuya Iwashita, Fumiya MAEDA, Koichi Ozaki, Tadao Fukuta 2024-01-23
11865609 Method for manufacturing powder-modified magnesium alloy chip Koichi Ozaki, Tadao Fukuta, Makoto Kato 2024-01-09
11866808 Method for manufacturing thixomolding material Hidefumi NAKAMURA, Makoto Kato 2024-01-09