FM

Fumiya MAEDA

SE Seiko Epson: 1 patents #470 of 1,165Top 45%
Overall (2024): #464,477 of 561,600Top 85%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11878345 Thixomolding material Shunsuke UCHIZONO, Setsuya Iwashita, Yasutoshi Hideshima, Koichi Ozaki, Tadao Fukuta 2024-01-23