Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12084374 | Method for producing glass wafers for packaging electronic devices, and electronic component produced according to the method | Frank Gindele, Christian Rakobrandt, Robert Hettler, Takahisa Uchida | 2024-09-10 |