Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12084374 | Method for producing glass wafers for packaging electronic devices, and electronic component produced according to the method | Frank Gindele, Kazuhito Miyawaki, Robert Hettler, Takahisa Uchida | 2024-09-10 |
| 11933485 | Hermetically sealed LED light and method for manufacturing a hermetically sealed LED light | Frank Gindele | 2024-03-19 |
| 11870013 | Hermetically sealed optoelectronic module having increased output of electromagnetic radiation | Frank Gindele, Alexander Neumeier, Robert Hettler | 2024-01-09 |