Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168538 | Continuous unloading and packaging system of pharmaceutical additive manufacturing | Peng Wang, Renjie Li, Feihuang DENG, Haili Liu, Senping CHENG +1 more | 2024-12-17 |
| 12118707 | System and method for semiconductor topography simulations | Nuo Xu, Ji-Ting Li, Yuan-Hao Chang, Zhiqiang Wu, Wen-Hsing Hsieh | 2024-10-15 |