Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159095 | Method of designing interconnect structure of semiconductor apparatus and method of manufacturing semiconductor apparatus using the same | Joonnyung Lee, Yeongjun KWON, Jaeyong Shin, Jeonghoon Ahn | 2024-12-03 |
| 12107034 | Semiconductor chip and semiconductor package including same | Shaofeng Ding, Sungwook Moon, Jeonghoon Ahn | 2024-10-01 |