Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159095 | Method of designing interconnect structure of semiconductor apparatus and method of manufacturing semiconductor apparatus using the same | Joonnyung Lee, Yeongjun KWON, Jaeyong Shin, Yunki Choi | 2024-12-03 |
| 12107034 | Semiconductor chip and semiconductor package including same | Shaofeng Ding, Sungwook Moon, Yunki Choi | 2024-10-01 |
| 11955509 | Metal-insulator-metal capacitor | Jihyung Kim, JaeHee Oh, Shaofeng Ding, Wonji Park, Jegwan Hwang | 2024-04-09 |