Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051680 | Semiconductor package aligning interposer and substrate | Tae Hwan Kim, Hyung-Gil Baek, Kang Gyune Lee, Sang Won Lee, Yong Kwan Lee | 2024-07-30 |
YK
Young-Ja Kim
Overall (2024): #206,957 of 561,600Top 40%
1
Patents 2024