Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051680 | Semiconductor package aligning interposer and substrate | Tae Hwan Kim, Young-Ja Kim, Kang Gyune Lee, Sang Won Lee, Yong Kwan Lee | 2024-07-30 |
| 11862570 | Semiconductor package | Jung Joo Kim, Sun Chul Kim, Min-Keun Kwak, Hyun Ki Kim, Yong Kwan Lee | 2024-01-02 |