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Yeo-Hoon Yoon

Samsung: 1 patents #7,344 of 17,120Top 45%
📍 Yongin-si, KR: #1,349 of 2,761 inventorsTop 50%
Overall (2024): #210,829 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11862589 Wafer-level package including under bump metal layer Hyung-Sun Jang 2024-01-02