Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862589 | Wafer-level package including under bump metal layer | Yeo-Hoon Yoon | 2024-01-02 |
HJ
Hyung-Sun Jang
Overall (2024): #437,852 of 561,600Top 80%
1
Patents 2024