Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11926695 | High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same | Kyeong Pang, In Hwan Kim, Jonghoon WON, Hyejeong Lee, Songwon Hyun | 2024-03-12 |