Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11926695 | High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same | In Hwan Kim, Jonghoon WON, Mooho Lee, Hyejeong Lee, Songwon Hyun | 2024-03-12 |
| 11901499 | Battery case and battery | Song Won Hyun, In-Ki Kim, Moo Ho LEE, Hye-Jeong Lee, In Su Lee | 2024-02-13 |