Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183574 | Two-dimensional semiconductor based printable optoelectronic inks, fabricating methods and applications of same | Mark C. Hersam, Jian Zhu | 2024-12-31 |
| 12144124 | Low-roughness surface-treated copper foil with low bending deformation, copper clad laminate comprising same, and printed wiring board | Chang Yol Yang, Kideok SONG, Sunhyoung Lee | 2024-11-12 |