Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12144124 | Low-roughness surface-treated copper foil with low bending deformation, copper clad laminate comprising same, and printed wiring board | Jung-Woo Seo, Kideok SONG, Sunhyoung Lee | 2024-11-12 |