Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046526 | Methods of fabricating semiconductor package | Jin-Woo Park, Jae Gwon Jang, Gwang Jae Jeon | 2024-07-23 |
| 12009277 | Semiconductor package | Dong Kyu Kim, Jong Youn Kim, Yeon Ho JANG, Jae Gwon Jang | 2024-06-11 |
| 11967549 | Semiconductor package | Jong Youn Kim, Min Jun Bae | 2024-04-23 |