Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046526 | Methods of fabricating semiconductor package | Jung-Ho Park, Jin-Woo Park, Gwang Jae Jeon | 2024-07-23 |
| 12009277 | Semiconductor package | Dong Kyu Kim, Jung-Ho Park, Jong Youn Kim, Yeon Ho JANG | 2024-06-11 |