Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990439 | Semiconductor package including under bump metallization pad | Changeun Joo, Gyujin Choi | 2024-05-21 |
JL
Jaeean Lee
Overall (2024): #428,330 of 561,600Top 80%
1
Patents 2024