Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990439 | Semiconductor package including under bump metallization pad | Jaeean Lee, Changeun Joo | 2024-05-21 |
| 11978696 | Semiconductor package device | Jae Ean LEE, Changeun Joo | 2024-05-07 |
| 11972966 | Method of manufacturing a semiconductor package including correcting alignment error while forming redistribution wiring struture | Changeun Joo | 2024-04-30 |
| 11961812 | Semiconductor packages having vias | Changeun Joo | 2024-04-16 |