Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990444 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the same | Taeyeong Kim, Hoechul Kim | 2024-05-21 |
| 11984345 | Substrate processing apparatus and driving method thereof | Hunyong Park, Sohee Han, Nohsung Kwak | 2024-05-14 |
| 11942344 | Method of determining a critical temperature of a semiconductor package and apparatus for performing the same | Mingi Hong, Choongbo Shim, Heejin Kim, Nungpyo Hong | 2024-03-26 |