Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961824 | Semiconductor package including stacked chip structure | Hyunggyun NOH, Sangwoo Pae, JINSOO BAE, Iljoo Choi, Keunho Rhew | 2024-04-16 |
DC
Deokseon Choi
Overall (2024): #488,146 of 561,600Top 90%
1
Patents 2024