SP

Sangwoo Pae

Samsung: 1 patents #7,344 of 17,120Top 45%
📍 Seongnam-si, OR: #1 of 1 inventorsTop 100%
Overall (2024): #282,287 of 561,600Top 55%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11961824 Semiconductor package including stacked chip structure Hyunggyun NOH, JINSOO BAE, Iljoo Choi, Deokseon Choi, Keunho Rhew 2024-04-16