MD

Mark T. Dimke

Rockwell Collins: 1 patents #54 of 225Top 25%
📍 Walnut, CA: #13 of 53 inventorsTop 25%
🗺 California: #26,178 of 67,048 inventorsTop 40%
Overall (2024): #362,567 of 561,600Top 65%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11948855 Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader Bret W. Simon, Jacob R. Mauermann, Kaitlyn M. Fisher 2024-04-02