JM

Jacob R. Mauermann

Rockwell Collins: 1 patents #54 of 225Top 25%
📍 Marion, IA: #18 of 49 inventorsTop 40%
🗺 Iowa: #539 of 1,728 inventorsTop 35%
Overall (2024): #427,776 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11948855 Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader Bret W. Simon, Mark T. Dimke, Kaitlyn M. Fisher 2024-04-02