Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074120 | Electric component with pad for a bump and manufacturing method thereof | Robert Felix BYWALEZ, Monika Schmiedgen | 2024-08-27 |
| 11967938 | Corrosion resistant pad for enhanced thin film acoustic packaging (TFAP) | Robert Felix BYWALEZ | 2024-04-23 |
| 11894829 | Variation of metal layer stack under under bump metallization (UBM) | Niklaas Konopka, Alexander Landel | 2024-02-06 |