AL

Alexander Landel

RP Rf360 Singapore Pte.: 1 patents #17 of 79Top 25%
Overall (2024): #550,581 of 561,600Top 100%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11894829 Variation of metal layer stack under under bump metallization (UBM) Ute Steinhaeusser, Niklaas Konopka 2024-02-06