Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183620 | Apparatus and method for bonding a plurality of dies to a carrier panel | Hwee-Seng Jimmy Chew, Li Jiang Huang, Siew Wen Lee, Qing Guan, Wai Hoe Lee +1 more | 2024-12-31 |
| 11990445 | Apparatus and method for semiconductor device bonding | — | 2024-05-21 |