Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183620 | Apparatus and method for bonding a plurality of dies to a carrier panel | Amlan Sen, Li Jiang Huang, Siew Wen Lee, Qing Guan, Wai Hoe Lee +1 more | 2024-12-31 |
| 11990353 | Semiconductor device with buffer layer | Senthil Kumar MUNIRATHINAM | 2024-05-21 |
| 11990431 | Semiconductor structures with via openings and methods of making the same | — | 2024-05-21 |
| 11881415 | Method of packaging chip and chip package structure | — | 2024-01-23 |