Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148675 | Power semiconductor package unit of surface mount technology including a plastic film covering a chip | Wei-Ming Hung, Wen-Liang Huang, Shun-Chi Shen, Chien-Chun Wang, CHI-HSUEH LI | 2024-11-19 |
| 11916030 | Method for manufacturing side wettable package | CHI-HSUEH LI | 2024-02-27 |