Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148675 | Power semiconductor package unit of surface mount technology including a plastic film covering a chip | CHUNG-HSIUNG HO, Wei-Ming Hung, Wen-Liang Huang, Shun-Chi Shen, CHI-HSUEH LI | 2024-11-19 |